电子元器件灌封 potting：电子元器件灌封的主要作用是为元器件提供全方位的保护，确保其在复杂环境中的稳定性和可靠性。

The main role of electronic components potting is to provide a full range of protection for components to ensure their stability and reliability in complex environments.

电路板防护 PCB protection：电路板保护胶水通过密封绝缘、防潮防震及耐腐蚀防护，确保电子元件在复杂环境中稳定运行并延长使用寿命。

Circuit board protection glue by sealing insulation, moisture, shock and corrosion protection, to ensure the stable operation of electronic components in complex environments and extend the service life.

显示屏组装 Display assembly：连接液晶面板与背光源、边框等，贴合触摸屏部件，用于显示屏密封，提升显示效果与寿命。

Connect the LCD panel with the backlight, border, etc., and fit the touch screen components to seal the display and improve the display effect and life.

电子设备外壳组装Shell bonding：粘接外壳部件，密封防尘防水，增强结构强度，用于粘贴装饰件，提升外观。

Adhesive shell parts, seal dust and waterproof, enhance structural strength, used to paste decorative parts, improve the appearance.

导热散热 Heat conduction：连接发热元件与散热片，凭借高导热系数与良好粘接性，高效传递热量 。

Connect heating element and heat sink, with high thermal conductivity and good adhesion, efficient heat transfer.